– For the fastest Drill Sharpener - Grinders: Disco-DFG8560
In addition to the growing TDR/SRD family of drill grinders we invite the challenge to help solve non-traditional tool grinding needs. Send us the tools, we'll choose the right equipment or design as needed. 33 years of meeting the industrial markets need for versatility, precision and convenience makes grinders produced by Service Precision ...DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge ...اقرأ أكثر
Servicing Disco Grinding Equipment - Hard Disk Grinding Machine : 5 Steps (with Pictures ...
Dicing and Grinding Service; Support. Support. Introduction to DISCO customer support, including support systems, product improvement information, and troubleshooting. ... Training Services. DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them ...Jun 16, 2021· Disco DAG810 is a single axis automatic wafer grinder that can grind wafers up to 300mm diameter. With one air bearing grind spindle and one vacuum chuck mounted on a high precision mechanical lower spindle this grinder has a relatively small footprint of only 11 square feet. This grinder can perform either standard in-feed (plunge) grinding or ...اقرأ أكثر
Floor Grinding & Polishing Machines, Tools & Equipment - Disc Mills from RETSCH - fast and powerful grinding
Dicing-Grinding Service at. DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction.Dicing and Grinding Service. This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA (San Jose). It is also possible to provide these services with machines that ...اقرأ أكثر
Dicing and Grinding Service | Solutions | DISCO Corporation - Dicing-Grinding Service by DISCO - dicing-grinding service
Disco-DFG8560 Grinders Supports advancements for thinner and larger wafers Φ300 mm 2 axes, 3 chuck tables DBG Wafer Thinning Inherited grinding specifications with an established reputation DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same …DISCO HI-TEC EUROPE . Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]اقرأ أكثر
DISCO machines and supplyer's equipment - dicing-grinding - Welcome to Giorgio Technology Sales/Service
Disco-DFG8340 Grinders Supports small volume grinding with high precisio Φ200 mm 1 axis, 2 chuck tables Stable, high-precision wafer processing With the integration of devices, wafer manufacturing processing, which requires high- planarity, is adopting surface grinding. DFG8340, the successor of DFG830 (equipment used all across the world), is equipped with a high-rigidity spindle, realizing ...Jun 16, 2021· Disco DFG841 system, with two grind spindles, two wafer vacuum chucks, and a robot arm, features a same-cassette return function. The robot arm vacuum feature ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness or trouble-free handling. For safety, the DFG841 complies with the EC's CE ...اقرأ أكثر
Wafer Fabrication Solutions - Sales & Service Inc - UNITED GRINDING North America | Precision Grinding Machines
High Precision Equipment & Processes Deliver Exceptional Results. We use fully-automated Disco and Strasbaugh wafer backgrinding equipment to achieve the highest possible level of quality and can continuously achieve thin wafer target thicknesses to less than 0.050mm (0.002").Disc Mills. RETSCH Vibratory Disc Mills are particularly suitable for rapid, loss-free grinding of hard, brittle and fibrous materials to analytical fineness. The mills are primarily used for sample preparation for spectral analysis. Due to their robust construction disc mills are used under rough conditions in laboratories and pilot plants, as ...اقرأ أكثر
Product Information | DISCO Corporation - Disco DAG810 Disco DAG810 Disco DAG810 - AxusTech
High-Quality Grinding of Lithium Tantalate. 6-inch GaAs Wafer Thinning when it is Secured with Tape. Warpage due to grinding damage. GaAs Wafer Thinning with Tape Securing Process. The Center Offset Grinding of TAIKO Wafer. The Applications of a TAIKO Wafer. Thickness control by using NCG. Processing of Glass to a Mirror Surface.Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. ... Dicing and Grinding Service; Support. Support. Introduction to DISCO customer support, including support systems, product improvement information, and troubleshooting ...اقرأ أكثر
Equipment - AxusTech - Wafer Backgrinding Services | Silicon Wafer Thinning Services
We specialize in refurbished dicing equipment. We have over 20 years of experience in the semiconductor industry. When you purchase used dicing saws from Semiconductor Systems, you are getting top quality equipment at a competitive rate. List of Manufacturers supported: ADT, Disco, K & S, MTI, STC, SVG. We provide the following services ...Condition: Refurbished. Buehler MiniMet™ 1000 Grinder Polisher with Accessories and Power cable. Price: $1,499.95. Condition: Used. (1) Spindle Strasbaugh Grinder/Polisher Model 6UR-1. Price: Please Inquire. Condition: Refurbished. (4) Spindle DC Drive STRASBAUGH Grinder/Polisher 21" x 80" Stainless Steel Pan - 16" Dia. Capacity - One ...اقرأ أكثر
Automatic Backgrinding & Polishing Service & Solution | GDSI - High-Quality Grinding of Lithium Tantalate | Grinding ...
READ the operation manual of the cutting/grinding equipment before use. DO NOT USE the precision tooling with modified or customized equipment. DO NOT USE precision tooling that has a different size from the one recommended for your equipment. DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.Training Services. DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. ... Dicing and Grinding Service.اقرأ أكثر
Koyo Machinery USA - Grinding Machine Tools - Warpage due to grinding damage - DISCO Corporation
Die Prep Services | Wafer Dicing & Grinding Company San Jose. We bridge a critical gap in your supply chain, servicing small to medium sized lot requirements often ignored by the large foundries and OSATS. We are frequently utilized by IC test and packaging groups, recognized as "best of breed" for the most demanding wafer thinning and ...Accretech is best known for Probers and Measurement Instruments and tools, but they also have been manufacturing Dicing Saws since the 1970s. DAStech, a spinoff of Disco, is known as the leader in Slicing Saws and technology. We also offer a full line of dicing blades, back grind wheels, UV and Non-UV tape for both dicing and back grinding.اقرأ أكثر
Dicing and Grinding Using the Conventional Process (TGM - Aurotech Corporation | About Us
Disco Hi-Tec America. Wafer Process Services Available for Laser Dicing, Blade Dicing and Grinding. Disco Hi-Tec has always been known as the industry standard for saw, grinding and laser tools. Disco's facility located in, Santa Clara, California can also provide valued services with their knowledgeable engineers and high-tech tools.Grinding of wafers with supporting substrates. DFG8830 is compatible with workpieces bonded to substrates such as glass or ceramic. This equipment supports substrate sizes from Φ5 to 8-inch and workpieces with substrates up to a total thickness of 3.5 mm.اقرأ أكثر
Disco DFG841 - AxusTech - Buehler - Metallography Equipment & Supplies for Sample ...
DISCO's Fully Automatic Grinder and Grinder/Polisher usually measure wafer thickness in grinding process and control wafer thickness by contact gauge. NCG measure wafer thickness without contact, and has advantage below. NCG avoid the risk of breaking wafer which is weak in load, for example the cavity configuration or a wafer ultrathinning.PHONE 860 355-1382. Cavco Machine Tool Rebuilding is a Connecticut based machine tool rebuilder.As a machinery and machine tool rebuilding, we offer rebuilding on tool room and production machine tools as well as machine tool repairs.We have been a machine tool rebuilder and retrofitter since 1980. We also offer on-site way grinding for machine tools.اقرأ أكثر
Disco Chiller DTU 1531 – Semiconductor Systems - Machine Tools | Rockford, IL | Obsidian Manufacturing Ind ...
Mar 09, 2021· UNITED GRINDING is your solutions partner, with products and services designed to assist you throughout the life cycle of your CNC grinding machineGrinding is a process for making board-shaped workpieces thin (approx. less than 1 mm thick) and flat by using a grinding wheel. The grinding wheel is an abrasive which uses synthetic diamond. Wheel segments (thickness: several millimeters, height: 3 – 5 mm) are arranged along a ring-shaped wheel base. There are various types of grinding ...اقرأ أكثر
Die Prep Services | Wafer Dicing & Grinding Company San Jose - Grinding Wheels: GF13 Series - Aurotech
With the JUTWIST 2000 high-speed grinding machine, grinding worm shaft profiles from blank became cheaper, more accurate and faster. The new machine concept makes it possible to grind parts with up to six starts with a clamping length of up to 300 mm and a swing diameter of …Step 3: Preparar El Disco. 2 More Images. Tiene que quedar asi! (solo el disco y el motorcito brushless) Ahora con cuidado hay que sacar el disco quitando los tornillos (solo el disco, el motor brushless no hay que quitarlo) y recortamos una lija del mismo tamaño, la pegamos al disco y volvemos a ensamblarlo en su lugar. Ask Question.اقرأ أكثر